Metals for Communications, Semiconductors and Packages

●Clad metals for heat spreaders

【Features】

These materials, with their properties of low thermal expansivity (compared to Cu) and high heat conductivity (compared to 36NI-Fe and Fe) have been developed using our own composite technology. They can be easily pressed into shapes as shown below, and can also be brazed or soldered. These materials are ideally suited for use in heat-dispersion substrates, such as for LEDs and laser diodes.

【Applications】

Heat-dispersion substrates, such as for LEDs and laser diodes