The thermal expansivity of these materials agrees in a wide temperature range with that of hard glass and ceramics, which makes them suitable for applications requiring hermetic sealing, such as MEMS packages. We also make considerable use of clad metals which efficiently release heat generated by laser diode chips.
This clad metals has a good thermal expansion and heat spreading characteristics and is use for laser diode bases.
Usage example: Laser diode
・Iron/Copper clad pressed into a diode mount base
* Copper (Cu) has a good thermal conductivity while iron (Fe) provides good sealing with glass.