• Japanese

Processing technology

●Drawing

Drawing image

We can meet the customer requirements, covering through to press working and brazing.

Cap for electronic component housing packages is a lid for hermetic sealing of ceramic cases (parts container) which hold electronic component.

In downsizing electronic devices and improving their performance, for effective use of space inside the electronic parts container, an electronic component housing package with a cavity lid for hermetic sealing is being developed.

【Applications】

Cap for electronic component housing packages
Hermetic sealing of ceramic packages

(Appearance of cavity lid)

Appearance of cavity lid

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