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Processing technology

●Metal Ball Manufacturing Process

We have technologies for manufacturing Ni-P unified spherical particles in diameter ranging from 1μm to 20μm. We can also have high conductivity and high corrosion resistance plating technology on the surface of Ni-P unified particles.


SEM image of Cu cored solder balls

Conductive Ni-P particles

Highly conductive, unified fine particles

Currently, electronic devices such as smartphones and tablet terminals are evolving towards higher resolutions, multifunctional, and lower profiles. In this trend, there is a growing demand for precise gap control between substrates and IC chips and anisotropic conductive connections between substrates.

We manufacture these highly conductive unified fine particles of uniform size by wet reduction method, which was developed jointly by Group Company and Akita Prefectural Resources Technology Development Organization. It is a potential technology that enables the higher performance and higher density required for next-generation electronic components.

  • ・Monodisperse. High sphericity. High corrosion resistance. Uniform particle size distribution
  • ・Unified fine particles. Diameter:1-20μm
  • ・High conductivity and high corrosion resistance by ultra-thin Au plating.
  • ・Other low-resistance plating (Cu, Ag, Solder, etc.)