Proterial Metals, Ltd. TOP > Products > Metals for Communications, Semiconductors and Packages
> Copper strip for ceramic substrates
Metals for Communications, Semiconductors and Packages
●Copper strip for ceramic substrates
【Features】
This material, which has characteristics similar to those of C1020 alloy, suppresses the coarsening of crystal grains that tends to occur with high-temperature heat treatment in ceramic bonding processes.
【Usage example】
ceramic substrates
【Materials】
OFC-HC and OFC-HC2
- Products
-
- Metals for Environment and Energy
- Metals for Automobiles
- Metals for Communications, Semiconductors and Packages
-
- Iron-Nickel-Cobalt alloys
- Iron-Nickel alloys
- Low thermal expansion alloys for precision equipment
- Permalloys
- Clad metals for heat spreaders
- Metals for laser diodes
- Clad metals for smartphones
- Bimetals
- Metal parts for package sealing
- Au coated Ni-P particles
- Lead pins
- Metals for functional parts
- Copper alloy strip for semiconductor lead frames
- Dual gauge copper strip
- Plated copper strip and dual gauge copper strip
- Copper strip for heat sinks and heat spreaders
- Copper strip for ceramic substrates
- General industry
- Metals for Domestic Electrical Applications
- Metals for Special Applications
- Material technologies
-
- Material technologies
- Processing technology
- Surface treatment technologies
- Corporate Profile
- Contact Us
PAGE TOP
COPYRIGHT ©Proterial Metals, Ltd.
ALL RIGHTS RESERVED.
PAGE TOP 