Surface Treatment Technologies

●Plating (Electrolytic and Electroless plating)

We are able to respond to a wide variety of needs with our plating technologies, such as Au plating for contact materials and contacts, environmentally-friendly lead-free solder plating, and electroless plating for ceramics and metals.

We have also established an Au plating technology to plate large quantities of fine Ni-P particles having large specific surface area, which has been deemed difficult. We therefore offer technologies that are essential to improve the performance and air tightness of electronic components.

【Applications】

• ・Lead pins for MPU
• ・Lead pins for electronic components
• ・Insulating substrates
• ・Printed circuit boards, etc.

Example of mass production

Comparison between our electroless plating and existing methods

Existing electroless Ni-P plating using Pd catalyst (Catalytic plating) our electroless plating (New method that prevents adsorption of Pd catalyst between patterns)

* Pd catalyst is partially adsorbed between patterns, causing deposits.
* Our electroless plating with high reliability allows no deposits or short circuit between circuits.

【Materials】

• ・Copper
• ・Copper Alloys, etc.